Copper Process Contracts Swarming Into ASE

Taipei, June 21, 2010 (CENS)--Swarming contracts from over 200 customers for copper wire bonding services are estimated to bring in Advanced Semiconductor Engineering Inc. (ASE) record revenue this year and further consolidate its leading position in the industry, according to the company's chief operating officer (COO), Tianyu Wu.

Wu reported the company's sales performance in June is better than May, and sales for the third quarter would grow from the second quarter thanks to stronger-than-expected demand for copper-wire bonding services.

In spite of the ongoing European debt crisis, Wu still showed guarded optimism about the sales prospects for the fourth quarter.

The company has set its revenue for this year at US$4 billion, soaring over 50% from last year's US$2.6 billion. Wu said this goal is viable as the company has developed strong presence in new technologies and international markets.

He said in addition to copper wire bonding, the company would provide other cutting-edge packaging technologies such as aQFN (advanced quad flat no lead) package and Fan-Out wafer level package.

Set to increase cooper wire bonding machines to 3,000 by the end of this year from current 2,600 systems, the company has recently revised upward capital expenditure for this year to US$600-700 million from originally planned US$450-500 million. The