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搜尋結果 collection Ball Joint: 153 則新聞

Prospects Brighten for Taiwan Chip Assemblers

(2003/08/29)

H.S. Tung, the chief financial officer of Taiwan's No. 1 chip assembler, Advanced Semiconductor Engineering Inc. (ASE), predicted early this month that the world chip-assembly market would improve greatly next year and that it would even experience stronger growth in the second half of 2003. Th

Orient, Winstek team up to offer back-end IC services

(2003/06/13)

Taipei, June 13, 2003 (CENS)--Orient Semiconductor Electronics, Ltd. And Winstek Co. recently announced that they had entered into a strategic alliance to offer a full range of back-end chip-processing services, including packaging, testing and assembly. Executives of both companies emphasized

Adlink, All Ring Tech jointly venture into chip-making equipment market

(2003/02/21)

Taipei, Feb. 21, 2003 (CENS)--Foreseeing a turnaround in the world market for chip assembling and testing equipment, Adlink Technology Inc. and All Ring Tech Co., Ltd. Recently announced plans to jointly tap into the market. The two Taiwanese manufacturers expect their cooperation to generate r