Orient, Winstek team up to offer back-end IC services

Taipei, June 13, 2003 (CENS)--Orient Semiconductor Electronics, Ltd. And Winstek Co. recently announced that they had entered into a strategic alliance to offer a full range of back-end chip-processing services, including packaging, testing and assembly.

Executives of both companies emphasized that the partnership will enhance their competitiveness. Orient will offer its specialized packaging and module assembling services bundled with Winstek's testing services.

The two companies will target their joint services at chipset and graphics chip developers that need chip assembly services using ball grid array (BGA) and other high-performance methods.

Orient recently invested in plastic ball grid array (PBGA), flip chip and other high-performance packaging techniques, helping it win business from high-end chipset and graphics chip suppliers. Winstek is able to provide testing for chips encased with such high-performance packaging methods.

In the past, Orient has generally developed its testing capability through acquisitions. Recently, however, it has opted to cooperate with established chip testers instead.

Winstek president C.L. Weng said that the partnership with Orient would help his company offer efficient services to attract orders from heavyweight chip designers.

Orient and Winstek are not the first chip packager and tester in Taiwan to form an alliance. Similar ties have also been formed between Advanced Semiconductor Engineering (ASE), Taiwan's biggest chip assembler, and ASE Test Ltd.; as well as among Siliconware Precision Industries Co., Ltd., Amkor and Thailin Semiconductor Corp.

Such cooperation has proved beneficial to all partners concerned. For example, Thailin has added NT$10 million to NT$20 million (US$286,000 to US$571,000 at US$1:NT$35) to its monthly revenue since teaming up with Siliconware and Amkor.