Market Demand for Ultrabooks to Simmer

Taipei, Nov. 28, 2011 (CENS)--Heavily promoted by global PC brands, market demand for ultrabook laptops is expected to start simmering worldwide from the Christmas through the coming months, according to industry insiders.

Intel, the pioneer promoter of ultrabooks and major processor designer for the devices, has heralded the arrival of ultrabook booms, indicating that over 11 ultrabook models from different PC brands will be launched by the end of 2011.

The number will further surge to some extent starting January 2012, up to 50 more models will be displayed at CES (Consumer Electronics Show) 2012, scheduled for January 10 through 13 in Las Vegas, the U.S., show organizer confirmed, adding that that such products will become one of the biggest hits at the show.

Intel has also forecast that over 60 different models of ultrabooks will be on market in 2012, most of which will be built with Ivy Bridge, the firm's newest processor model set for debut at CES 2012 as well.

Despite market prospects of ultrabooks remaining uncertain for the moment, there is still good news that 1,000 units of an ultrabook model brought by a brand to Indonesia were sold out in only two hours. This has somewhat encouraged players in the field, boosting their confidence that the product will serve as a business reviver amid a flagging PC market.

Parts suppliers involved in the supply chain of ultrabooks forecast that the ultrabook boom will be first seen from the Christmas and year-end sales season through Lunar New Year 2012. Given the fact that ultrabooks are well received by consumers, they went on to note, prospects of the products will be increasingly bright, and then may drive brand customers to place rush orders starting in February 2012.

Also optimistic about the upcoming ultrabook boom, some institutional investors pointed out that Taiwanese ultrabook vendors as Acer and Asus, and related parts suppliers, including Catcher Technology Co. and Foxconn Technology Co. (PC cases), Chaun Choung Technology Corp. (thermal dissipation modules), Adata Technology Inc (memory modules), and Simplo Technology Co. and Dynapack International Technology Corp. (batter modules) will likely gain considerable steam in the coming year.