LED & Applications | LED Heatsink Modules:

Thermal Silicone Pad

MP series

Thermal Silicone Pad (1.6~14.0 W/mk) ---------------------- In increase of heat transfer rate Soft and compressible Natural tack As buffer mate...

Non-Silicone Thermal Pad

NS-20,NS-30,NS-50,NS-80

Non-Silicone Thermal Pad (2.0~8.0 W/mk) --------------- In increase of heat transfer rate Soft and compressible Natural tack As buffer material...

Thermal Putty

45G

Thermal Putty (4.5 W/mk) ------------- In increase of heat transfer rate. It can be infinitely compression. Low thermal resistance

Thermal Compound

GC-04,GC-04G,GC-07

Thermal Grease (4.1~7.0 W/mk) ---------------- In increase of heat transfer rate. Not easy dry and not harden. Maximize the heat transfer Very ...

Thermal Conductive Glass Fiber Sheet

FB-25

Fiberglass Insulation Thermal Sheet (1.3~3.5 W/mk) -------------------------- Electrical isolation Electric resistance As buffer material Easy...

Company:	I.M TECHNOLOGY CO., LTD.