Cooling Systems | Heat Sinks:

Thermal Silicone Pad (1.6~14.0 W/mk) ---------------------- In increase of heat transfer rate Soft and compressible Natural tack As buffer mate...

Thermal Tape (1.1~2.0 W/mk) --------------- In increase of heat transfer rate Easy to assemble Alternative for glue and screw Variety of thickn...

Non-Silicone Thermal Pad (2.0~8.0 W/mk) --------------- In increase of heat transfer rate Soft and compressible Natural tack As buffer material...

Temperature Uniformity EMI Shielding Material (X-Y axis ,237 W/mk) Nano Carbon Copper Film (X-Y axis ,500 W/mk) --------------------- Temperature...

Thermal Putty (4.5 W/mk) ------------- In increase of heat transfer rate. It can be infinitely compression. Low thermal resistance

Thermal Grease (4.1~7.0 W/mk) ---------------- In increase of heat transfer rate. Not easy dry and not harden. Maximize the heat transfer Very ...