COMPANY PROFILE
ChipSiP Technology Co., Ltd., founded in 2002, provides SiP (System in Package) miniaturization solutions and services for wearable and smart devices. We create the smallest and easy-to-implement memory, logic, and RF SiP chips via SiP package design, which can further reduce the size of system board in order to reach a smaller, lighter and thinner device.
ChipSiP is well-experienced in both design and integration of logic and RF field. Our products have been applied to wearables, digital multimedia, wireless communications, computing and smart home. To provide smart connected products for a smart life, ChipSiP is committed to driving the core miniaturization technologies to bring smart devices into our daily lives.