TSLC Excels in LED CSP Packaging

Taiwan Semiconductor Lighting Co. (TSLC) produces high-power LED emitters for general lighting using a unique chip-scale packaging (CSP) technology based on silicon substrate and aluminum nitride (AlN) substrate, providing customers with high price/performance ratio solutions and tailor-made products.

Using unorthodox surface mount device (SMD) and phosphor coating technologies, the company completes 3535, 5050, 6363, 7070, and 9090 models of encapsulation on eight-inch silicon and AlN wafers at high output.

The encapsulations range from 1W to 55W, encased by dome lens projecting light at angles of 45, 60, and 120 degrees or lensless flat silicon.

TSLC's core technologies include excellent thermal dissipation thanks to the combination of AlN substrate with eutectic process and flip-chip bonding; high output with reliable quality thanks to the lens molding technology, which completes over 2,300 3535-type encapsulations on each eight-inch wafer; enhanced efficiency with silicon lens, which provides wide view angle ranging from 60 to 120 degree with light extraction efficiency of 15%; efficient phosphor coating technology, which completes one wafer of LEDs per five minutes, with defect free rate above 99%.

While unveiling a new factory on Dec. 20, 2013, the company will also hold a presentation on the same day to launch several emitters and LED lighting fixtures: 5060-type emitter for stage lighting, its 7070-type emitter, 1616-model emitter for mood lighting, IR5050 and 9090 emitters for security lighting, and 5W 3535 emitter for general lighting. The 5060 device features glass case and eutectic process while the 7070 comes with glass lens, four ultraviolet LEDs and projecting angle of 60 degree.

Its 160W high-bay lights are UL, CE, LM80, and DLC approved and its outdoor projector lights are rated over 30W and equipped with in-house designed linear IC power supply.

TSLC holds many patents as a supplier of mid-power and high-power emitters and modules.