TSMC Fast Tracks Sub-28nm Projects

Dec 08, 2011 Ι Industry In-Focus Ι Electronics and Computers Ι By Ken Liu, CENS
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Taipei, Dec. 8, 2011 (CENS)--Taiwan Semiconductor Manufacturing Co. (TSMC) will synchronously construct the third and fourth production lines of its Fab 15 wafer fab and get them running in 2013, to pave the way for its migration to 20nm process technology.

The world's No. 1 pure silicon foundry has recently started pilot production with the first production line of this cutting-edge 300mm wafer fab and will put it into general production after the upcoming Chinese New Year, which falls on January 23, 2012. The second line, still under construction, is set to start pilot production in the fourth quarter 2012. Both lines are set aside for making 28nm chips, with first line designed to have output of 50,000 wafers of chips or so a month in the initial stage.

According to the company's chairman and chief executive officer (CEO), Morris Chang, the company's 28nm chip output will reach 24,000 wafers a month in 2012, with more of which contributed by Fab 15. Industry executives estimated the set output goal will be attained in the third quarter of next year.

The Fab 15, which is situated in the Central Taiwan Science Park, costs TSMC over NT$400 billion (US$13.3 billion at US$1: NT$30) in investment. The factory was originally planned to make chips with 28nm and 40nm process technologies. Now, the company has decided to move 40nm chip production to its factories in the Southern Taiwan Science Park in southern Taiwan.
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