TSMC Said to Make Chipset for Intel's Ivy Bridge Platform

Taipei, March 2, 2011 (CENS)--Intel Corp. is said to contract Taiwan Semiconductor Manufacturing Co. (TSMC) to make the 40nm south bridge chipset codenamed Partner Point for its next-generation processing platform christened Ivy Bridge.

Intel will launch the platform sometime in the fourth quarter this year, one quarter ahead of schedule. Industry executives noted that earlier rollout would help Intel gain an advantageous position in the competition against Advanced Micro Devices (AMD) in the market for 40nm platforms.

Intel and its strategic partners are demonstrating applications for its Sandy Bridge platform and will tell its customers in private about Ivy Bridge plan at the CeBIT 2011 trade fair, which opened on March 1. PC heavyweights including Asustek Computer, Acer and Compal are displaying Sandy Bridge-powered wares at the show, which is recognized as the world's biggest IT trade event.

Industry executives expect the contract, once delivered in the fourth quarter, to bring TSMC fresh growth momentum in the second half of this year.

Intel has declined to comment on when Ivy Bridge will be available on the market while TSMC has refused to comment on Intel's outsourcing strategy.

Also, AMD has contracted TSMC to build its 40nm accelerated processing units coded Zacate and Ontario, making TSMC the primary beneficiary of the competition between Intel and AMD for dominance on 40nm market.

Industry executives pointed out that the top two microprocessors have increased outsourcing contracts on cost concern.