Taipei, Nov. 10, 2008 (CENS)--Dell Inc., the world`s second-largest brand of notebook PCs, has launched its newest Studio and Insipron series consumer notebook PCs, which are built with Intel`s Centrino 2 processors and assembled by Taiwanese Wistron Corp., the world`s third-largest supplier of notebook PCs, to compete against Hewlett-Packard Co.

The most noteworthy feature of the newest notebook PCs is artistic exterior design which is effectively embodied with Dell`s newest surface processing technology Picaso. According to PC case suppliers, the technology is derived from Transprint technology, a process usually applied to spray discs with thin films, and Dell applies it onto its notebook PCs to achieve more visual attractions than competing models.

Besides, the technology allows Dell to apply more individual designs to satisfy consumers` demand for customized notebook PCs; however, it costs higher in production than IMR (in-mold reprint) technology, as the latter can be applied in mass production of notebook PCs.

IMR technology was developed jointly by HP, Nissha Printing Co., Ltd. of Japan and Benten International Ltd. of Taiwan, and, since HP launched its first notebook PC with an IMR-treated case in 2006, the technology has been widely adopted in notebook PCs. Industry insiders opine that the technology has helped HP to consolidate its leading position in the global market for notebook PCs.

However, as explosively increasing popularity of IMR technology causes shortages of thin films for the process, world`s major notebook PC brands, such as Dell, Acer and Asusteck, have been forced to develop new printing technologies, like Dell`s Picaso, as alternatives to the IMR.

In the meantime, Dell is planning to continuously expand staffers in its R&D center in Taiwan next year. At the moment, the center has a total workforce of 450 to take charge of development of Dell`s newest notebook PCs for sale in the global market. In response to increasing consumer demand for products featuring good designs, Dell this year has set up a new division in the center to work on industrial designs, feasibility research and packaging designs.

(by Steve Chuang)